Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling

The abrasion mechanism in solid-solid contact mode of the chemical mechanical polishing (CMP) process is investigated in detail. Based on assumptions of plastic contact over wafer-abrasive and pad-abrasive interfaces, the normal distribution of abrasive size and an assumed periodic roughness of pad surface, a novel model is developed for material removal in CMP. The basic model is = removed, wh...

A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP)

Advanced Process Control in Dielectric Chemical Mechanical Polishing (cmp)

The decrease in device dimensions is placing extremely tight constraints on many aspects of the CMP process. We outline four key areas that will provide significant steps toward attaining this level of control. In particular, we discuss the need for improved in-line surface topography metrology, and show that that high resolution profilometry appears to meet this need. We demonstrate the need f...

A Mechanical Model for Erosion in Copper Chemical-mechanical Polishing

The Chemical-mechanical polishing (CMP) process is now widely employed in the ultra-large-scale integrated semiconductor fabrication. Due to the continuous decrease in the sub-micron feature size, characterization of erosion has become an important issue in Cu CMP. In this paper, the erosion in Cu CMP is considered at two levels: wafer and die levels. Erosion models are developed based on the m...

Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (cmp) Processes Using a Large Pattern Test Mask

We have used a large pattern test mask and a specific arrangement of structures on a wafer for direct measurement of an average planarization length for copper chemical mechanical polishing (CMP) processes. We propose new minimum, maximum, and average planarization length definitions, based on up and down area measurements as a function of trench width. The average planarization length is usefu...